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Spark plasma sintering furnace with HIP processing and 20T pressure

This equipment is mainly used by colleges, universities, scientific research institutions, etc. to carry out pressurized heating and sintering treatment on metal compounds, ceramics, inorganic compounds, nanomaterials, etc. under vacuum or protective atmosphere conditions in order to obtain high-density products, such as the production of high-precision silicon nitride ceramic bearings, etc.




Technical Parameters

Product Description:

This equipment is mainly used by colleges, universities, scientific research institutions, etc. to carry out pressurized heating and sintering treatment on metal compounds, ceramics, inorganic compounds, nanomaterials, etc. under vacuum or protective atmosphere conditions in order to obtain high-density products, such as the production of high-precision silicon nitride ceramic bearings, etc.

Technical Parameters:

Product ModelKS-SPS-20T
Power supply three-phase 380V   50Hz
Output current DC 0-6000A
Output voltage DC 0-12V
Maximum temperature 2100℃
Rated temperature room   temperature-2000℃
Number of temperature control zones one zone
Temperature control method thermocouple   temperature measurement at low temperature of 1000℃, infrared temperature measurement at high temperature above 1000℃
Temperature control accuracy ≤1000 degrees ±1℃. ≧1000℃ ±1~2℃
Cold state vacuum limit ≤6.7*10-3Pa (empty furnace, cold state, after baking and degassing)
Inflatable atmosphere inert gas
Inflatable pressure (slightly positive pressure) ≤0.03MPa
Maximum pressure 20T (hydraulic   digital display, automatic pressure adjustment, automatic pressure   maintenance, manual function reserved)
Working area pressure head size diameter Ф150 mm
Sample size Ф10~150mm   sintering sample size depends on sintering sample temperature
Pressure fluctuation ≤±200N, displacement accuracy ≤0.02mm
Pressure stroke 0~100mm (digital   display)
Pressure control hydraulic   electric control
Control mode touch screen +   plc mode
Heating rate ≤600℃/min