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Precision glue film hot plate baking machine KS-SP-HP6

Heating output independent circuit control, improve the safety performance of the equipment can manually switch vacuum adsorption substrate, close contact with baking mode

High precision digital display temperature control meter control, can be equipped with linear temperature control function with hot radiation seal cover, hard anodized alumina heating panel


Technical Parameters

Product Features:

All anode alumina fuselage structure, simple and beautiful

The precision of temperature control is high, the thermal uniformity is good, and the practicability is strong.

Heating output independent circuit control, improve the safety performance of the equipment can manually switch vacuum adsorption substrate, close contact with baking mode

High precision digital display temperature control meter control, can be equipped with linear temperature control function with hot radiation seal cover, hard anodized alumina heating panel

The sinking design of heating structure is small in size and convenient in glove box.

Technical Parameters:

ModelKS-SP-HP6
Size of heating panel φ 170mm circle
Temperature control range room temperature-250 °C
Temperature resolution 0.1 °C
Temperature control accuracy + 0.2 °C (after temperature stabilization)
Temperature uniformity ≤ 1%
Power input 220V, 5A, 800W
Suitable substrate size less than 6 inches of wafer
Vacuum interface outer diameter 6mm of rear plate outlet of equipment
Vacuum input requirements 0.04~0.09Mpa
Size 370mm (W) * 270mm (D) * 126mm (H)