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Advanced program control glue film hot plate KS-SP-HP200-SE

Hard anodic alumina corrosion resistant panel

7 inch full color touch screen operation, advanced PLC control can reduce the operation height, embedded installation design with automatic lifting function, close to baking mode belt linear temperature control and vacuum adsorption function


Technical Parameters

Product Features:

Hard anodic alumina corrosion resistant panel

7 inch full color touch screen operation, advanced PLC control can reduce the operation height, embedded installation design with automatic lifting function, close to baking mode belt linear temperature control and vacuum adsorption function

Technical Parameters:

ModelKS-SP-HP200-SE
Heating panel size 340mm*340mm square
Power input 220V, 3500W (110V optional)
Temperature control range room temperature-300 °C
Temperature resolution 0.1 °C
Temperature control accuracy + 0.2 °C
Temperature uniformity 200 °C ≤ 1%, 200 °C ~ 300 °Cs1.5% can store 100 groups of baking gel formula, each formula can set 5 heating stages electric thimble adjustment height  0-30mm
Thimble height resolution 0.1mm.The thimble can use substrate diameter larger than 120mm wafer, special requirements can be customized vacuum interface HP200- PE equipment rear plate outlet outer diameter 6mm
Vacuum input requirements 0.04~0.09Mpa
Out dimension 423mm(W)* 562mm(D)*295mm(H)