Home - Products - PVD Coating Machine - Multi-Chamber Magnetron Sputtering and Ion Beam Combined System KS-MCMS-IBD
Equipment Application:
Used in the preparation of nano-level single-layer and multi-layer functional films, hard films, metal films, semiconductor films, dielectric films and other new thin film materials. Can be widely used in large.
Scientific research and small batch preparation of thin film materials in colleges and research institutes.
Technical Parameters
Equipment composition:
The system is mainly composed of sputtering vacuum chamber, sampling chamber, permanent magnetron sputtering target (three targets), single substrate heating table, DC power supply, radio frequency power supply, working gas .It is composed of circuit, air extraction system, vacuum measurement, electric control system and installation machine.
Technical Parameters:
Ultimate vacuum: ≤6.8x10-5 Pa (after baking and degassing);
Leak rate of system vacuum leak detection: ≤5.0x10-7 Pa.l/S;
After the system is exposed to the atmosphere for a short time and filled with dry nitrogen, it starts to pump, and it can reach 8.0x10-4 Pa in 40 minutes;
The vacuum degree after stopping the pump for 12 hours after shutdown: ≤4Pa.
