Automatic metallographic grinding and polishing machine KS-GPM-250

Introduction:

This model is a single-chip microcomputer controlled grinding and polishing machine. The shell is formed with ABS material, which is beautiful in appearance, anti-corrosion and durable. It is stepless speed control and can change the rotational direction. The grinding head has individual pressure and central pressure two methods. This machine can effectively replace the manual grinding and polishing processes, which greatly saves labor and improves the quality of grindingand polishing and the efficiency of sample preparation. Therefore it is the idealequipment for the metallographic sample preparation.

Features:

1.    With high-definition LCD touch screen, the operation is easy and the display is clear and intuitive.

2.    It is an automatic grinding and polishing system, the time and speed can be set and the water value is automatically controlled, which can effectively replace manual grinding and polishing.

3.    With special self-adaptive design of grinding disc, it makes the sample and grinding disc fit perfectly, which effectively solve the multi-faceted phenomenon and

ensures the consistency of grinding surface.

4.     With the automatic locking function of the grinding head, the operation is safe  and convenient.

5.    With magnetic grinding disc design, it supports for fast disc replacing system.

The disc surface is Teflon painted which makes no residue of changing abrasive    paper and polishing cloth.

6.    The motor is DC brushless motor which has long service life and low noise and powerful motor brings strong power and efficient grinding and polishing experience.

7.    Strong large support chassis design ensures the precision rotary balance. Spindle leak-proof design ensures the bearing without damage.

8.    It can store ten kinds of grinding and polishing procedure, set different parameters for different samples.

9.    With semi-rotating design of the grinding disc and the inner lighting system, it is

easy to take and place the samples.

Technical Parameters: