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Chemical vapor deposition (CVD) refers to the method of chemical gas or vapor reacting on the surface of the substrate to synthesize coatings or nanomaterials. It is a very widely used technology for depositing thin film materials in the semiconductor industry, including a wide range of insulating materials and Most metal materials and metal alloy materials
Technical Parameters
Product Description:
Chemical vapor deposition (CVD) refers to the method of chemical gas or vapor reacting on the surface of the substrate to synthesize coatings or nanomaterials. It is a very widely used technology for depositing thin film materials in the semiconductor industry, including a wide range of insulating materials and Most metal materials and metal alloy materials. For this reason, we have developed a complete set of CVD coating systems, which are suitable for the fields of materials laboratories, scientific research institutes, environmental sciences and other fields of major universities.
Technical parameters:
Product model | KS-CVD1200-110 |
Working temperature | ≤1100C |
Heating zone size | 200mm |
Voltage supply | 380V, 3 phase |
Power rate | 15Kw |
Working pressure range | 0-0.15Mpa |
Gas system | float flow meter with 2,3,4 channel optional |