Diamond wire cutting saw for crystal KS-CS-170

Application of wire cutting saw KS-CS-170:

Precision cutting of metal, non-metal precious or super hard materials. Especially for precision cutting of artificial crystals, ceramics, optics, agate, jade and semiconductor materials.

Features:

1. The    X-axis mobile platform is supported by double linear guides, driven by precision ball screws/stepping motors, and controlled by PLC. The feed speed can be adjusted infinitely.Between 0.01 micron and 100 mm/min , and manage cutting data.

2. The   Y- axis mobile platform is composed ofDouble linear guide rail support, precision ball screw/stepInto the motor drive, PLC control, can accurately control the cutting thickness (two decimal places), moving length: 120 mm. 
3. The    X-axis mobile platform is equipped with a two-dimensional rotating (horizontal direction 360° and vertical direction ±45°) fixture, and the fixture (Z axis) is equipped with a rotatable carrier plate driven by a stepping motor and stepless speed regulation. PLC controls the rotation speed of the stepping motor to be between 0-100 rpm , which can realize the point contact cutting of the diamond wire and the material. In this way, the cutting resistance does not change with the change of the cutting depth, so that the shape of the cutting surface is consistent and the flatness of the material to be cut is realized. Taking cutting white gemstones (4 inches) as an example, the efficiency can be doubled compared with non-rotating cutting . You can also stop the stepping motor and change from rotating cutting to non-rotating cutting to realize rectangular and angular cutting.

4. The    PLC program performs data control and management on the cutting feed speed, the total cutting length, the cutting thickness, the number of rotations, the linear speed of the diamond wire, the distance and direction of the drum movement, etc.;

5. Diamond cutting micro-wire tensioning adopts double loop adjustable air pressure device;

Technical Parameters: