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KS-PL-8M vacuum plasma cleaner machine is a plasma surface treatment system which is an innovative experimental platform developed for universities, scientific research institutes and enterprise laboratories, or innovative enterprises with small batch production.
Technical Parameters
KS-PL-8M vacuum plasma cleaner machine is a plasma surface treatment system which is an innovative experimental platform developed for universities, scientific research institutes and enterprise laboratories, or innovative enterprises with small batch production.
Advantages:
It has the characteristics of stable performance, high cost performance, easy operation, low cost of use and easy maintenance.
Ultra-cleaning and modification of surfaces of metals, ceramics, glass, silicon wafers, plastics, etc. with various geometric shapes and surface roughness.
Thoroughly remove organic contaminants from the sample surface.
Timed processing, fast processing, and high cleaning efficiency.
It is environmentally friendly, does not use chemical solvents, and has no secondary pollution to samples and the environment.
Ultra-cleaning is carried out under normal temperature conditions, and the sample is non-destructively treated.
Application field
Ultra-cleaning of optical components, electronic components, semiconductor components, laser devices, coated substrates, terminal mounting, and the like.
Cleaning a variety of lenses and slides such as optical lenses and electron microscopes.
The photoresist material on the surface of the optical element, the semiconductor element, or the like is removed to remove the oxide on the surface of the metal material.
Cleaning semiconductor components, printed wiring boards, ATR components, intraocular lenses, natural crystals and gemstones.
Technical Parameters:
Model | KS-PL-8M |
stainless steel chamber | Φ215mm × 235mm |
Capacity | 8.5 liters |
Power supply | AC220V,or can be customized |
Working current | not more than 1.2A (excluding vacuum pump) |
RF power supply | 0-200W (select a section before leaving the factory) |
RF frequency | 13.56MHz optional (offset less than 0.2KHz) |
Frequency offset | less than 0.2KHz |
Characteristic impedance | 50 ohms, automatic matching |
Vacuum degree | 10Pa-1000Pa |
Gas flow | 60-600ml/min (adjustable) |
Process control | MCU automatic and manual mode |
Touch screen | 4.3 inch |
Power size | 10%-100% adjustable |
Dimensions | 404x640x615mm |
Cooling method | Forced air cooling |